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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
The ML Series family of Transient Voltage Surge Suppression devices is based on the Littelfuse Multilayer fabrication technology. These components are designed to suppress a variety of transient events, including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance (EMC). The ML Series is typically applied to protect integrated circuits and other components at the circuit board level. The wide operating voltage and energy range make the ML Series suitable for numerous applications on power supply, control and signal lines. The ML Series is manufactured from semiconducting ceramics, and is supplied in a leadless, surface mount package. The ML Series is compatible with modern reflow and wave soldering procedures. It can operate over a wider temperature range than zener diodes, and has a much smaller footprint than plastic-housed components. Littelfuse Inc. manufactures other Multilayer Series products. See the MLE Series data sheet for ESD applications, MHS Series data sheet for high-speed ESD applications, the MLN for multiline protection and the AUML Series for automotive applications.
Features
* Leadless 0402, 0603, 0805, 1206 and 1210 Chip Sizes * Multilayer Ceramic Construction Technology *-55oC to +125oC Operating Temperature Range * Operating Voltage Range VM(DC) = 5.5V to 120V * Rated for Surge Current (8 x 20s) * Rated for Energy (10 x 1000s) * Inherent Bi-directional Clamping * No Plastic or Epoxy Packaging Assures Better than 94V-0 Flammability Rating * Standard Low Capacitance Types Available
Applications
* Suppression of Inductive Switching or Other Transient Events Such as EFT and Surge Voltage at the Circuit Board Level * ESD Protection for Components Sensitive to IEC 61000-4-2, MIL-STD-883C Method 3015.7, and Other Industry Specifications (See Also the MLE or MLN Series) * Provides On-Board Transient Voltage Protection for ICs and Transistors * Used to Help Achieve Electromagnetic Compliance of End Products * Replace Larger Surface Mount TVS Zeners in Many Applications
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Absolute Maximum Ratings For ratings of individual members of a series, see Device Ratings and Specifications table.
Continuous: ML SERIES Steady State Applied Voltage: DC Voltage Range (VM(DC)). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 to 120 AC Voltage Range (VM(AC)RMS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 to 107 Transient: Non-Repetitive Surge Current, 8/20s Waveform, (ITM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 to 500 Non-Repetitive Surge Energy, 10/1000s Waveform, (WTM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 to 2.5 Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125 Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150 Temperature Coefficient (V) of Clamping Voltage (VC) at Specified Test Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <0.01
UNITS
V V A J O C O C %/OC
3
SURFACE MOUNT VARISTORS
Device Ratings and Specifications
MAXIMUM RATINGS (125 oC) MAXIMUM NONREPETITIVE SURGE CURRENT (8/20s) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000s) MAXIMUM CLAMPING VOLTAGE AT 10A (OR AS NOTED) (8/20s) SPECIFICATIONS (25 oC)
MAXIMUM CONTINUOUS WORKING VOLTAGE
NOMINAL VOLTAGE AT 1mA DC TEST CURRENT VN(DC) VN(DC) MAX (V) 7.0 7.0 7.0 7.0 9.3 9.3 9.3 9.3 9.3 14 14 16.0 14 18.5 20.3 20.3 20.3 20.3 20.3
TYPICAL CAPACITANCE AT f = 1MHz
VM(DC) VM(AC) PART NUMBER V3.5MLA0603 V3.5MLA0805 V3.5MLA0805L V3.5MLA1206 (V) 3.5 3.5 3.5 3.5 5.5 5.5 5.5 5.5 5.5 9 9 9.0 9.0 12 14 14 14 14 14 (V) 2.5 2.5 2.5 2.5 4.0 4.0 4.0 4.0 4.0 6.5 6.5 6.5 6.5 9.0 10 10 10 10 10
ITM (A) 30 120 40 100 20 30 120 40 150 20 4 30 40 40 20 30 120 40 150
WTM (J) 0.1 0.3 0.1 0.3 0.050 0.1 0.3 0.1 0.4 0.050 0.020 0.1 0.1 0.1 0.050 0.1 0.3 0.1 0.4
VC (V) 10 at 2A 10 at 5A 10 at 2A 14 15.5 at 1A 15.5 at 2A 15.5 at 5A 15.5 at 2A 15.5 22 at 1A 25 at 1A 23 at 2A 20 at 2A 25 at 2A 30 at 1A 30 at 2A 30 at 5A 30 at 2A 30
MIN (V) 3.7 3.7 3.7 3.7 7.1 7.1 7.1 7.1 7.1 11 11 11.0 11 14 15.9 15.9 15.9 15.9 15.9
C (pF) 1100 2200 1200 6000 220 660 1600 860 4500 120 33 420 450 350 70 150 480 270 1600
NEW
V5.5MLA0402 V5.5MLA0603 V5.5MLA0805 V5.5MLA0805L V5.5MLA1206
NEW NEW
V9MLA0402 V9MLA0402L V9MLA0603 V9MLA0805L V12MLA0805L
NEW
V14MLA0402 V14MLA0603 V14MLA0805 V14MLA0805L V14MLA1206
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Device Ratings and Specifications
(Continued)
MAXIMUM RATINGS (125 oC) MAXIMUM NONREPETITIVE SURGE CURRENT (8/20s) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000s) MAXIMUM CLAMPING VOLTAGE AT 10A (OR AS NOTED) (8/20s) SPECIFICATIONS (25 oC)
MAXIMUM CONTINUOUS WORKING VOLTAGE
NOMINAL VOLTAGE AT 1mA DC TEST CURRENT VN(DC) VN(DC) MAX (V) 28.0 28.0 28.0 28.0 28.0 28.0 38 38.5 38.5 38.5 38.5 46 46 43 43 49 60 66.5 66.5 77 83 90 115 165
TYPICAL CAPACITANCE AT f = 1MHz
VM(DC) VM(AC) PART NUMBER (V) 18 18 18 18 18 18 26 26 26 26 26 30 30 30 30 33 42 48 48 56 60 68 85 120 (V) 14 14 14 14 14 14 20 20 20 20 20 25 25 25 25 26 30 40 40 40 50 50 67 107
ITM (A) 20 30 120 40 150 500 30 100 40 150 300 30 30 280 220 180 180 250 220 180 250 180 250 125
WTM (J) 0.050 0.1 0.3 0.1 0.4 2.5 0.1 0.3 0.1 0.6 1.2 0.1 0.1 1.2 0.9 0.8 0.8 1.2 0.9 1.0 1.5 1.0 2.5 2.0
VC (V) 40 at 1A 40 at 2A 40 at 5A 40 at 2A 40 40 58 at 2A 58 at 5A 58 at 2A 56 54 65 at 2A 65 at 2A 62 62 72 86 100 100 110 120 130 160 230
MIN (V) 22 22 22 22 22 22 31 29.5 29.5 29.5 29.5 37 37 35 35 38 46 54.5 54.5 61 67 76 95 135
C (pF) 40 125 450 250 1100 1250 90 190 115 900 1000 75 80 1575 1530 550 550 450 430 150 375 150 225 65
NEW
V18MLA0402 V18MLA0603 V18MLA0805 V18MLA0805L V18MLA1206 V18MLA1210 V26MLA0603 V26MLA0805 V26MLA0805L V26MLA1206 V26MLA1210 V30MLA0603 V30MLA0805L V30MLA1210 V30MLA1210L V33MLA1206 V42MLA1206 V48MLA1210 V48MLA1210L V56MLA1206 V60MLA1210 V68MLA1206 V85MLA1210 V120MLA1210
NOTES: 1. L suffix is a low capacitance and energy version; Contact your Littelfuse Sales Representative for custom capacitance requirements. o 2. Typical leakage at 25 C<25A, maximum leakage 50A at VM(DC); for 0402 size, typical leakage <5A, maximum leakage 10A at VM(DC). 3. Average power dissipation of transients for 0402, 0603, 0805, 1206 and 1210 sizes not to exceed 0.03W, 0.05W, 0.1W, 0.1W and 0.15W respectively.
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Temperature De-rating
When transients occur in rapid succession, the average power dissipation is the energy (watt-seconds) per pulse times the number of pulses per second. The power so developed must be within the specifications shown on the Device Ratings and Specifications table for the specific device. For applications exceeding 125oC ambient temperature, the peak surge current and energy ratings must be derated as shown in Figure 1.
PERCENT OF RATED VALUE PERCENT OF PEAK VALUE 100
50
0 t O1 t1 TIME
100 80
3
SURFACE MOUNT VARISTORS
t2 60 40 20 0 -55 50 60 70 80 90 100 110 120 130 140 150
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM FOR CLAMPING VOLTAGE
O1 = VIRTUAL ORIGIN OF WAVE t = TIME FROM 10% TO 90% OF PEAK t1 = VIRTUAL FRONT TIME = 1.25 x t t2 = VIRTUAL TIME TO HALF VALUE (IMPULSE DURA TION) EXAMPLE: FOR AN 8/20s CURRENT WAVEFORM 8s = t1 = VIRTUAL FRONT TIME 20s = t2 = VIRTUAL TIME TO HALF VALUE
AMBIENT TEMPERATURE ( oC)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
100 MAXIMUM CLAMPING VOLTAGE
Varistor Voltage (V)
MAXIMUM LEAKAGE
10 V18MLA0402 V14MLA0402 V09MLA0402 V5.5MLA0402
1 A
10A
100A
1mA
10mA CURRENT (A)
100mA
1A
10A
100A
FIGURE 3. LIMIT V-I CHARACTERISTIC FOR V5.5MLA0402 TO V18MLA0402
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Maximum Transient V-I Characteristic Curves
100
Varistor Voltage (V)
MAXIMUM LEAKAGE
MAXIMUM CLAMPING VOLTAGE
V9MLA0402L 10
1 A
10A
100 A
1mA
10mA CURRENT (A)
100mA
1A
10A
FIGURE 4. LIMIT V-I CHARACTERISTIC FOR V9MLA0402L
100 MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
Varistor Voltage (V)
10
V30MLA0603 V26MLA0603 V18MLA0603 V14MLA0603 V9MLA0603 V5.5MLA0603 V3.5MLA0603 1 A 10A 100A 1mA 10mA 100mA 1A 10A 100A
CURRENT (A)
FIGURE 5. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0603 TO V30MLA0603
100 MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
Varistor Voltage (V)
10
V30MLA0805L V26MLA0805L V18MLA0805L V14MLA0805L V9MLA0805L V5.5MLA0805L V3.5MLA0805L 1 A 10A 100A 1mA 10mA 100mA 1A 10A 100A
CURRENT (A)
FIGURE 6. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805L TO V30MLA0805L
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Maximum Transient V-I Characteristic Curves
100 MAXIMUM CLAMPING VOLTAGE MAXIMUM LEAKAGE
(Continued)
Varistor Voltage (V)
10 V26MLA0805 V18MLA0805 V14MLA0805 V5.5MLA0805 V3.5MLA0805 1 A 10A 100A 1mA 10mA CURRENT (A) 100mA 1A 10A 100A 1000A
3
SURFACE MOUNT VARISTORS
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FIGURE 7. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805 TO V26MLA0805
1000 V68MLA1206 V56MLA1206 V42MLA1206 V33MLA1206 V26MLA1206 V18MLA1206
Varistor Voltage (V)
100
V14MLA1206 10
V5.5MLA1206 V3.5MLA1206
MAXIMUM LEAKA GE 1 1A 10A 100A 1mA 10mA
MAXIMUM CLAMP VOLTAGE 100mA 1A 10A 100A 1000A
CURRENT (A)
FIGURE 8. LIMIT V-I CHARACTERISTIC FOR V3.5MLA1206 TO V68MLA1206
1000 MAXIMUM CLAMPING VOLTAGE MAXIMUM LEAKAGE
100
V120MLA1210 Varistor Voltage (V) 10 V85MLA1210 V60MLA1210 V48MLA1210, V48MLA1210L V30MLA1210, V30MLA1210L V26MLA1210 V18MLA1210 1 1 A 10A 100A 1mA 10mA CURRENT (A) 100mA 1A 10A 100A 1000A
FIGURE 9. LIMIT V-I CHARACTERISTIC FOR V18MLA1210 TO V120MLA1210
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Device Characteristics
CLAMPING VOLTAGE (V) 100
At low current levels, the V-I curve of the multilayer transient voltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect (Figure 10). At or below the maximum working voltage, the suppressor is in a high resistance mode (approaching 106 at its maximum rated working voltage). Leakage currents at maximum rated voltage are below 50A, typically 25A; for 0402 size below 10A, typically 5A.
100% SUPPRESSOR VOLTAGE IN PERCENT OF
V26MLA1206
V5.5MLA1206
T VNOM VALUE A 25 oC (%)
10 -60
-40
-20
0
40 60 80 20 TEMPERATURE ( oC)
100
120
140
FIGURE 12. CLAMPING VOLTAGE OVER TEMPERATURE (VC AT 10A)
o
25 10% 1E -9 1E -8
50o 75o 1E -7
100o 125oC 1E -6 1E -5 1E -4 1E -3 1E -2
Energy Absorption/Peak Current Capability
Energy dissipated within the ML is calculated by multiplying the clamping voltage, transient current and transient duration. An important advantage of the multilayer is its interdigitated electrode construction within the mass of dielectric material. This results in excellent current distribution and the peak temperature per energy absorbed is very low. The matrix of semiconducting grains combine to absorb and distribute transient energy (heat) (Figure 11). This dramatically reduces peak temperature; thermal stresses and enhances device reliability. As a measure of the device capability in energy and peak current handling, the V26MLA1206A part was tested with multiple pulses at its peak current rating (150A, 8/20s). At the end of the test, 10,000 pulses later, the device voltage characteristics are still well within specification (Figure 13).
100
SUPPRESSOR CURRENT (ADC)
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC CURVE IN THE LEAKAGE REGION
Speed of Response
The Multilayer Suppressor is a leadless device. Its response time is not limited by the parasitic lead inductances found in other surface mount packages. The response time of the Zinc Oxide dielectric material is less than 1 nanosecond and the ML can clamp very fast dV/dT events such as ESD. Additionally, in "real world" applications, the associated circuit wiring is often the greatest factor effecting speed of response. Therefore, transient suppressor placement within a circuit can be considered important in certain instances.
FIRED CERAMIC DIELECTRIC
PEAK CURRENT = 150A 8/20s DURA TION, 30s BETWEEN PULSES
METAL ELECTRODES METAL END TERMINATION
VOLTAGE
V26MLA1206
10 0 2000 4000 6000 NUMBER OF PULSES
DEPLETION REGION
8000
10000
12000
FIGURE 13. REPETITIVE PULSE CAPABILITY
DEPLETION REGION GRAINS
FIGURE 11. MULTILA YER INTERNAL CONSTRUCTION
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Soldering Recommendations
TEMPERATURE ( oC) 250 MAXIMUM TEMPERATURE 222 oC 200 40-80 SECONDS ABOVE 183 oC RAMP RATE <2oC/s 100 PREHEAT DWELL 50 PREHEAT ZONE
The principal techniques used for the soldering of components in surface mount technology are Infrared (IR) re-flow, vapour phase re-flow and wave soldering. Typical profiles are shown in Figures 14, 15 and 16. When wave soldering, the ML suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a conveyor and run through the soldering process to contact the wave. With IR and vapour phase reflow; the device is placed in a solder paste on the substrate. As the solder paste is heated, it re-flows and solders the unit to the board. The recommended solder for the ML suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. For 0402 size devices, IR re-flow is recommended. When using a reflow process, care should be taken to ensure that the ML chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. Examples of the soldering conditions for the ML suppressor are given in the tables below.
150
3
SURFACE MOUNT VARISTORS
0 0.0
0.5
1.0
1.5 2.0 2.5 TIME (MINUTES)
3.0
3.5
4.0
FIGURE 14. REFLOW SOLDER PROFILE
300 MAXIMUM WAVE 260 oC 250 TEMPERATURE ( oC) 200 150 SECOND PREHEAT 100 FIRST PREHEAT 50 0 0.0
Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50oC before cleaning.
Termination Options
Littelfuse offers three types of electrode termination finish for the Multilayer product series: 1. Silver/Platinum (standard, not available for 0402) 2. Silver/Palladium (optional) (The ordering information section describes how to designate them.) 3. Nickel Barrier (optional for 0402-1210 package size) (The ordering information section describes how to designate them.)
0.5
1.0
1.5
2.0 2.5 3.0 TIME (MINUTES)
3.5
4.0
4.5
FIGURE 15. WAVE SOLDER PROFILE
250 MAXIMUM TEMPERATURE 222 oC 200 TEMPERATURE ( oC) 40-80 SECONDS ABOVE 183 oC RAMP RATE >50oC/s 100 PREHEAT ZONE 50
150
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 TIME (MINUTES)
FIGURE 16. VAPOR PHASE SOLDER PROFILE
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Recommended Pad Outline
C
B
NOTE
A
NOTE: Avoid metal runs in this area.
TABLE 1: PAD LAYOUT DIMENSIONS PAD SIZE 1210 SIZE DEVICE DIMENSION A B C IN 0.160 0.100 0.040 MM 4.06 2.54 1.02 1206 SIZE DEVICE IN 0.160 0.065 0.040 MM 4.06 1.65 1.02 0805 SIZE DEVICE IN 0.120 0.050 0.040 MM 3.05 1.27 1.02 0603 SIZE DEVICE IN 0.100 0.030 0.035 MM 2.54 0.76 0.89 0402 SIZE DEVICE IN 0.067 0.020 0.024 MM 1.70 0.51 0.61
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Mechanical Dimensions
E
D
L W
3
SURFACE MOUNT VARISTORS
CHIP SIZE 1210 DIMENSION D Max. E L W IN 0.113 0.02 0.01 0.125 0.012 0.10 0.012 MM 2.87 0.50 0.25 3.20 0.30 2.54 0.30 IN 0.071 0.02 0.01 0.125 0.012 0.06 0.011 1206 MM 1.80 0.50 0.25 3.20 0.30 1.60 0.28 IN 0.043 0.01 to 0.029 0.079 0.008 0.049 0.008 0805 MM 1.10 0.50 to 0.25 2.01 0.20 1.25 0.20 IN 0.035 0.015 0.008 0.063 0.006 0.032 0.06 0603 MM 0.90 0.4 0.2 1.6 0.15 0.8 0.15 IN 0.024 0.010 0.006 0.039 0.004 0.020 0.004 0402 MM 0.61 0.25 0.15 1.0 0.1 0.5 0.1
Ordering Information
VXXML TYPES
V
18
MLA
1206
X
X
X
DEVICE FAMILY Littelfuse TVSS Device MAXIMUM DC WORKING VOLTAGE MULTILAYER SERIES DESIGNATOR
PACKING OPTIONS T: 13in (330mm) Diameter Reel H: 7in (178mm) Diameter Reel (Note) A: Bulk Pack END TERMINATION OPTION No Letter: Ag/Pt (Standard) W: Ag/Pd N: Nickel Barrier (0402 -1210). For 0402 package size, Nickel Barrier termination is subject to availibility. Please contact a Littelfuse sales representative. DEVICE SIZE: i.e 120 mil x 60 mil (3MM X 1.5MM) CAPACITANCE OPTION No Letter: Standard L: Low Capacitance Version
Standard Shipping Quantities
DEVICE SIZE 1210 1206 0805 0603 0402 "13" INCH REEL ("T"OPTION) 8,000 10,000 10,000 10,000 N/A "7"INCH REEL ("H"OPTION) 2,500 2,500 2,500 2,500 10,000 BULK PACK ("A"OPTION) 2500 2500 2500 2500 N/A
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Tape and Reel Specifications
* Conforms to EIA - 481-1, Revision A * Can be supplied to IEC Publication 286 - 3
SYMBOL A0 B0 K0 W F E P1 P2 P0 D0 D1 T 1 Width of Cavity Length of Cavity Depth of Cavity Width of Tape Distance Between Drive Hole Centers and Cavity Centers Distance Between Drive Hole Centers and Tape Edge Distance Between Cavity Centers Axial Drive Distance Between Drive Hole Centers & Cavity Centers Axial Drive Distance Between Drive Hole Centers Drive Hole Diameter Diameter of Cavity Piercing Top Tape Thickness
N/A 20.05
DESCRIPTION
DIMENSIONS IN MILLIMETERS
0402 Size 0603, 0805, 1206 & 1210 Sizes
Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. 8 0.2 3.5 0.05 1.75 0.1 4 0.1 2 0.1 4 0.1 1.55 0.05 1.05 0.05 0.1 Max
D0
P0 P2 E
F K0 B0
W
t1
D1
P1
A0
PLASTIC CARRIER TAPE
EMBOSSED PAPER (0402 SIZE ONLY)
PRODUCT IDENTIFYING LABEL
EMBOSSMENT TOP TAPE
8mm NOMINAL
178mm OR 330mm DIA. REEL
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